Bond Scope 350- Minature Dual-Mode, Handheld Ultrasonic Bond Tester
The All New BondaScope 350 is the latest in a series of highly affordable, feature-rich, high-performance ultrasonic bond testers available from NDT Systems, Inc., the originators of the first microprocessor-based impedance plane resonance bond tester.
New Industry-Leading Features of the BondaScope 350 Include:
Bond Profile Mode
Split Screen
Flying Dot Resonance (impedance plane) mode
High Energy Pulsed Pitch-Catch Mode
Full-featured Tone Burst mode
Separate Phase and Amplitude Alarm capability
Sunlight-viewable 3.9” LCD Display
True User Adjustable Display Persistence
Much More
Probes are dry or liquid film coupled, depending on the selected test mode.
Bond Profile
Bond Profile is a time-encoded scanning presentation whereby the phase/amplitude are plotted in real-time, yielding a time-based trend pattern allowing for user assessment. Operators generally find this information easier to comprehend, which increases their confidence level in the inspection. NDT Systems, Inc. was the first to offer this in the BondaScope 300, Miniature Pitch-Catch Bond Tester.
Applications
Applications include the inspection of metallic, non-metallic, and combination metallic/non-metallic bonded structures for a variety of anomalous conditions. Detectable anomalies include measurable levels of unbonds, voids, delaminations, inclusions, porosity, fiber damage, core damage, bond line thickness variations, and certain material properties. Inspectable configurations include adhesively bonded laminates, advanced fiber composites, and honeycomb structures, to mention a few.
Some typical applications include:
Multi-layer laminates
Graphite resin composites
Boron fiber composites
Kevlar composites
Glass fiber composites
Composite-to-substrate
Composite-to-composite
Honeycomb structures
Skin-to-honeycomb
Honeycomb-to-honeycomb
Impact damage
Price: Request Quotation
| Application | Description |
|---|---|
| Product Name | All New BondaScope 350 |
| Manufacturer | NDT Systems, Inc. |
| Probe Options | Dry or liquid film coupled (depending on the selected test mode) |
| Bond Profile | Time-encoded scanning presentation, plotting phase/amplitude in real-time for user assessment |
| Confidence Level | Enhanced through easier comprehension of information |
| Previous Model | BondaScope 300, Miniature Pitch-Catch Bond Tester |
| Inspection Applications | Metallic, non-metallic, and combination metallic/non-metallic bonded structures |
| Detectable Anomalies | Unbonds - Voids - Delaminations - Inclusions - Porosity - Fiber damage - Core damage - Bond line thickness Variations $ Certain material properties |
| Inspectable Configurations | Adhesively bonded laminates - Advanced fiber composites - Honeycomb structures |
| Typical Applications | Multi-layer laminates - Graphite resin composites - Boron fiber composites - Kevlar composites - Glass fiber composites - Composite-to-substrate - Composite-to-composite - Honeycomb structures - Skin-to-honeycomb - Honeycomb-to-honeycomb - Impact damage |
Description
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