Bond Scope 350- Minature Dual-Mode, Handheld Ultrasonic Bond Tester

The All New BondaScope 350 is the latest in a series of highly affordable, feature-rich, high-performance ultrasonic bond testers available from NDT Systems, Inc., the originators of the first microprocessor-based impedance plane resonance bond tester.
New Industry-Leading Features of the BondaScope 350 Include:

Bond Profile Mode
Split Screen
Flying Dot Resonance (impedance plane) mode
High Energy Pulsed Pitch-Catch Mode
Full-featured Tone Burst mode
Separate Phase and Amplitude Alarm capability
Sunlight-viewable 3.9” LCD Display
True User Adjustable Display Persistence
Much More

Probes are dry or liquid film coupled, depending on the selected test mode.

Description

Bond Profile

Bond Profile is a time-encoded scanning presentation whereby the phase/amplitude are plotted in real-time, yielding a time-based trend pattern allowing for user assessment. Operators generally find this information easier to comprehend, which increases their confidence level in the inspection. NDT Systems, Inc. was the first to offer this in the BondaScope 300, Miniature Pitch-Catch Bond Tester.

Applications
Applications include the inspection of metallic, non-metallic, and combination metallic/non-metallic bonded structures for a variety of anomalous conditions. Detectable anomalies include measurable levels of unbonds, voids, delaminations, inclusions, porosity, fiber damage, core damage, bond line thickness variations, and certain material properties. Inspectable configurations include adhesively bonded laminates, advanced fiber composites, and honeycomb structures, to mention a few.

Some typical applications include:

Multi-layer laminates
Graphite resin composites
Boron fiber composites
Kevlar composites
Glass fiber composites
Composite-to-substrate
Composite-to-composite
Honeycomb structures
Skin-to-honeycomb
Honeycomb-to-honeycomb
Impact damage

Model: DC0506N

Temperature range: -5 to 100℃
Temperature control precision: 0.1

The circular opening can be placed 200ml beaker, direct measurement of viscosity. The outer loop has the function of constant temperature cup can also be controlled constant temperature liquid lead to external, to meet different test requirements.

Additional information
Product Name

All New BondaScope 350

Manufacturer

NDT Systems, Inc.

Probe Options

Dry or liquid film coupled (depending on the selected test mode)

Bond Profile

Time-encoded scanning presentation, plotting phase/amplitude in real-time for user assessment

Confidence Level

Enhanced through easier comprehension of information

Previous Model

BondaScope 300, Miniature Pitch-Catch Bond Tester

Inspection Applications

Metallic, non-metallic, and combination metallic/non-metallic bonded structures

Detectable Anomalies

Unbonds
– Voids
– Delaminations
– Inclusions
– Porosity
– Fiber damage
– Core damage
– Bond line thickness Variations $ Certain material properties

Inspectable Configurations

Adhesively bonded laminates
– Advanced fiber composites
– Honeycomb structures

Typical Applications

Multi-layer laminates
– Graphite resin composites
– Boron fiber composites
– Kevlar composites
– Glass fiber composites
– Composite-to-substrate
– Composite-to-composite
– Honeycomb structures
– Skin-to-honeycomb
– Honeycomb-to-honeycomb
– Impact damage

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